How Moisture Can Cause FGH60N60SMD to Fail Prematurely

How Moisture Can Cause FGH60N60SMD to Fail Prematurely: Causes, Impact, and Solutions

The FGH60N60SMD is a type of IGBT (Insulated-Gate Bipolar Transistor) used in high-power applications like power supplies and motor drives. Moisture exposure can lead to premature failure of this component, often due to its sensitivity to environmental conditions. Below is an analysis of how moisture causes failure, the underlying causes, and step-by-step solutions for preventing and addressing moisture-related damage.

Causes of Premature Failure Due to Moisture

Corrosion of Internal Components: Moisture can infiltrate the casing of the IGBT module , which can lead to the corrosion of internal Electrical components, such as the gate, emitter, and collector pins. This corrosion creates resistive paths or short circuits that impair the functioning of the module.

Degradation of Insulating Materials: The materials that insulate the IGBT, such as epoxy or silicone gel, can degrade when exposed to moisture. Over time, this leads to reduced insulation resistance, causing electrical shorts or failures.

Condensation on Internal Circuitry: When moisture enters the device, it can cause condensation inside, leading to electrical short circuits. This often happens when the IGBT is exposed to sudden temperature changes (e.g., from hot to cold environments). Condensation directly damages the internal circuitry, leading to potential failure.

Electrochemical Migration: In the presence of moisture, electrical components in the IGBT, especially solder joints, are at risk of electrochemical migration. This phenomenon occurs when conductive paths form due to the movement of ions, which causes shorts and failure of the module.

Decreased Thermal Performance: Moisture infiltration can interfere with the heat dissipation mechanisms within the IGBT. As the moisture evaporates and condenses, it disrupts thermal management, which can result in the device overheating and failing due to thermal stress.

Impact of Moisture on the FGH60N60SMD IGBT Module

When moisture infiltrates the IGBT module, it can cause:

Reduced lifespan: Even low levels of moisture exposure over time can significantly shorten the operational life of the device. Erratic performance: Symptoms such as unexpected shutdowns or loss of control in power supply systems due to shorts or insulation failure. Complete failure: Severe moisture exposure can lead to complete functional loss of the IGBT, causing the system to fail.

Steps to Solve Moisture-Induced Failure of FGH60N60SMD

1. Prevention: Store and Handle Properly Control Storage Environment: Store IGBT modules in a dry, climate-controlled environment to prevent moisture from entering. Use desiccant bags inside storage boxes to absorb any moisture present. Use Sealed Packaging: Always keep IGBTs in sealed packaging until they are ready for use. This protects them from ambient humidity. Avoid Temperature Shocks: Avoid moving IGBTs directly from a cold to a hot environment, as this can cause condensation to form inside the module. 2. Dry the Module Before Use (If Exposed to Moisture) Heat Treatment: If you suspect moisture exposure, use a controlled heating process to remove moisture. Place the module in an oven set at a low temperature (around 60°C to 80°C) for several hours (6-12 hours) to ensure any trapped moisture evaporates. Use a Drying Chamber: If available, place the IGBT in a vacuum or drying chamber. This will further assist in extracting moisture without overheating the component. 3. Check for Visible Damage Inspect the module for any signs of corrosion or discoloration around the pins and connections. Look for any visible signs of moisture or condensation inside the module (e.g., droplets, fogging). Examine the insulation material for any visible degradation or cracking that could be a result of moisture damage. 4. Test the Module’s Electrical Performance Conduct a continuity test: Check for any short circuits or irregular electrical paths between the pins using a multimeter. Test insulation resistance: Use an insulation resistance tester to ensure the integrity of the module’s insulation. A significant drop in resistance compared to the manufacturer's specified values may indicate moisture-related degradation. 5. Replace Damaged Components If corrosion, electrochemical migration, or significant damage to the insulating material is found, the IGBT may need to be replaced. Replacing the module is often the most cost-effective and reliable solution when extensive damage is found, as repair might not restore it to full functionality. 6. Implement Moisture Protection in the System Use moisture-resistant coatings: Consider using moisture-resistant coatings or potting materials on the IGBT to further protect it from environmental humidity. Install environmental controls: Implement humidity and temperature controls in the system enclosure to prevent further moisture ingress, especially in outdoor or industrial settings. 7. Regular Maintenance and Monitoring Check the system regularly: Periodically inspect the IGBT and associated components for signs of moisture exposure or early degradation. Monitor environmental conditions: Ensure that your equipment is placed in a suitable environment, especially if it is exposed to changing or extreme weather conditions.

Conclusion

Moisture exposure can significantly affect the performance and longevity of FGH60N60SMD IGBT modules. Preventing moisture infiltration through proper storage, handling, and sealing is key. When moisture-related damage is suspected, taking prompt action to dry the module, inspect for damage, and implement protective measures can help restore functionality and prevent future failures.